Chips, PCBs, semiconductors and automotive parts undergo a burn in test at some point in the production. It uses extreme temperature, voltage, and power cycling conditions inside an environmental chamber. The test hastens the manifestation of hidden faults in the device by subjecting it to failure situations while under monitoring. The procedure uses high voltage and temperature to evaluate the load capacity of the semiconductor device.
Importance of Burn In Testing
Burn in testing is a predictive approach for identifying and discarding faulty solid-state electronic components before they enter the market or their installation into electronic devices. Most will describe burn in testing as a system of controlled application of electrical and thermal stress to a device to trigger intrinsic breakdowns. Aside from semiconductor components, PCBs, ICs, and CPU parts are often burn-in tested.
The burn-in test is one method for lowering early failure rates in semiconductors. Most early failures are the consequence of poor manufacturing materials and production faults. The faults become visible when the device begins to operate due to applied voltage stress and heating. Burn in tests are one of the many reliability test services that guarantee only components with minimal likelihood of premature failure reach the market.
Advantages of Burn In Testing
The burn-in test is the most effective screening method for removing high potential failures in semiconductor devices. Devices that pass this test are high quality and devoid of latent faults. Manufacturers can trust to use it in the final product assembly. It ensures that chips, PCBs, semiconductors and automotive parts will not break down under possible extreme conditions. A burn in or HTRB system will make it easier to ensure products are up to standards.
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